Plating defined using power, in solution positively charged metal ions, in place of the cathode conductor push surface coating. Copper plating is an "oxidation / reduction" reaction, a solution of copper metal anode to the surface oxidation of copper metal, copper ions become. On the other hand, the cathode reduction reaction, and so become copper metal copper ion deposition. Both are exchanged through medicine, chemistry reach the hole of the purpose of the exchange effect of a direct impact on the quality of the metallized holes are getting smaller and smaller pore size. Metalized hole interconnection between the layers depend, directly related to the quality of the printed circuit board reliability. With the narrow aperture, the original did not affect the larger aperture debris, such as grinding brush debris, ash, once left in the hole inside, will electroless copper plating copper out of action, there holes without copper, become hole metallized killer 

keywords: Area, surface craft, antioxidant capacity,