Shenzhen Electronic Technology Co., Ltd. Newell HDI imaging introduce a 1. achieve low defect rate and high yield, while able to achieve stable production of high-precision conventional HDI run. For example: * thickness of the copper circuit board advanced mobile phone, CSP pitch less than 0.5mm (connection [with or without wires between the disk] * plate structure 3 + n + 3, each face has three superimposed vias ( stacked via), * with superimposed vias 6-8 coreless PCB layers in imaging, such designs require ring width less than 75μm, ring width in some cases even less than 50μm. Because of the problem for buried vias circuit boards, which inevitably leads to low yields in addition, by the miniaturization of the drive circuit and the pitch is getting smaller - to meet this challenge will require changing the traditional imaging methods that can reduce the size of the panel, or by using a shutter exposure. panel-forming machine several steps (four or six). Both of these methods to reduce the impact by deformation of the material to be better para. to change the panel size leads to a high cost of the rigid-flex circuit board material , shutter exposure machine resulted in low daily production. Both of these methods can not completely resolve the photographic material deformation and reduced version of the drawbacks associated circuit boards, which includes the time of printing batch / batch photographic version of the actual deformation .2. By daily print the required number of panels required to achieve the production. As previously mentioned, the number of requirements related to production should take into account the accuracy of the claims. To achieve the production requirements, it needs to get automatic control high output rates. Shenzhen Market supply and demand Newell City Electronic Technology Co., HDI board analysis continued growth in mobile phone production to promote the growth of China's demand for HDI boards play an important role in the mobile phone industry in the world. In 2002, Motorola full use of mobile phones in the future since HDI board manufacturing, Currently more than 90 percent of mobile phone board HDI boards are used. Market research firm In-Stat released in 2006 research report predicts that over the next five years, the global mobile phone production will continue at a rate of about 15% growth in 2011, global The total sales of mobile phones will reach 2 billion multilayer circuit board _ Newell record (certified) _ board Newell provided by Shenzhen Electronic Technology Co., Newell Shenzhen Electronic Technology Co., Ltd. (www.yipcb .com) (www.yipcb.com) Guangdong Shenzhen, PCB's leaders over the years, the company implementing the scientific management, innovation and development, the principle of honesty and trustworthiness, and satisfy customer needs. In creating leadership with Newell staff warmly welcome all inquiries negotiations to create Newell create a better future.