Measures to improve the stability of a copper plating solution. Plus stabilizer added stabilizer for Cu + has a strong complexing ability of the solution Cu2 + ion complexation ability is poor, this solution Cu + ions can not produce a disproportionation reaction, which can stabilize the electroless copper effect solution. b. Gas stirred electroless copper plating process, the solution was stirred with air Shen copper circuit board glitch problem, to a certain extent, inhibit the generation of Cu2O, which play the role of a stable solution. c. Continuous filtration with continuous filtration 5μm particle filter electroless copper plating solution, you can always filtered active particulate material that appears in the bath. d. Was added copper granules masking polymer compound containing many hydroxyl, ether polymer compound can be adsorbed on the copper surface. After this, since the disproportionation reaction of the Cu2O generated copper particles, adsorbed on the surface of the polymer compound will lose catalytic properties no longer play the role of the decomposing solution. e. Control workload electroless copper plating solution for different workloads have different, if 'overload' will accelerate the decomposition of the electroless copper plating solution. Branch Snyder Department of International Ltd. Shenzhen-Electronic Technology Co., Ltd. - The Department of Electronic Technology Company is a professional custom single-sided, double-sided, 2-40 layer multilayer professional providers, to provide customers with high-precision, high Shenzhen circuit board quality, quality assurance, reasonable prices. Reduced copper formaldehyde reaction can proceed smoothly, depending on the bath of NaOH, within a certain range, with increasing values ??of NaOH solution, the deposition rate of copper in order to accelerate a heavy copper circuit board, but also not too high NaOH, Otherwise, side effects increased, resulting in an unstable bath. When the deposition rate of copper ion concentration electroless copper plating solution, along with the bath Cu2 + ion concentration increases accelerated heavy copper circuit board classification, almost direct proportion to increase in the low concentration range, but when added to a concentration of copper ion concentration , the deposition rate increases slowly. While high concentrations of Cu2 + ion plating can be obtained faster deposition rates sink copper circuit board, but the copper ion concentration is too high, increased side effects, causing instability in the bath. Shen copper circuit board glitch problem, Newell invasive, Guangdong Shen copper circuit board by the Department of Shenzhen-Electronic Technology Limited. Newell Shenzhen Electronic Technology Co., Ltd. (www.yipcb.com) (www.yipcb.com) quality of service and products, continue to receive the recognition and trust of new and old customers and the industry. Our company is a certified member of the whole alliance network operators, business alliance customer service icon on the page, you can talk directly with our customer service staff, to our future cooperation happy!