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Gold-plated circuit board black reason, Newell Year (online consultation), Guangdong gold-plated circuit boards
Information Name: | Gold-plated circuit board black reason, Newell Year (online consultation), Guangdong gold-plated circuit boards |
Published: | 2015-06-15 |
Validity: | 0 |
Specifications: | Any |
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Detailed Product Description: | Branch Snyder Department of International Ltd. Shenzhen-Electronic Technology Co., Ltd. - The Department of Electronic Technology Company is a professional custom single-sided, double-sided, 2-40 layer multilayer professional providers, to provide customers with high-precision, high Shenzhen circuit board quality gold-plated circuit boards antioxidant capacity, quality assurance, reasonable prices. Copper surface must also be micro-roughening treatment, the copper surface micro-roughness of the surface, in order to increase the bond strength of the copper layer and nickel layer. Because nickel coating has a certain stress, this stress, especially in bright copper surface will form a tensile stress, and the separation from the copper surface, the micro-roughened aim is to increase the nickel plating adhesion. Due to rough treatment properly, resulting in a copper layer surface asperity quality gold-plated circuit boards, so consistency nickel plating distribution directly affected, causing local with good adhesion six gold-plated circuit boards, scattered parts of the poor, and the nickel occurs layer layered from the copper surface. Branch Snyder Department of International Ltd. Shenzhen-Electronic Technology Co., Ltd. - The Department of Electronic Technology Company is a professional custom single-sided, double-sided, 2-40 storey density multilayer professional supplier, to provide customers with high-precision high quality Shenzhen board, quality assurance, reasonable prices. Activating the role of the copper precipitated on the surface layer of palladium, nickel starting as catalytic reactions of nuclei. Its forming process was chemically Pd and Cu in the displacement reaction. From the displacement reaction, the reaction rate of Pd and Cu will become slower, when Pd and Cu completely covered (without considering the sparse hole-dip), a substitution reaction will stop, but the actual production, it is impossible to The copper surface completely unnecessary activation (the copper surface completely covered). From a cost perspective, which makes Pd consumption soared sharply. More importantly, this is likely to cause serious quality problems diffusion coating and the like. Gold-plated circuit board black reason, Newell Year (online consultation), Guangdong gold-plated circuit boards by the Department of Shenzhen-Electronic Technology Limited. Newell Shenzhen Electronic Technology Co., Ltd. (www.yipcb.com) (www.yipcb.com) Guangdong Shenzhen, printed circuit board leaders, over the years, the company is implementing the scientific management, innovation and development, the principle of honesty and trustworthiness, and satisfy customer needs. In Newell create leadership with the staff warmly welcome all inquiries negotiations to create Newell create a better future. |
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Copyright © GuangDong ICP No. 10089450, Newell Shenzhen Electronic Technology Co., Ltd. All rights reserved.
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You are the 40885 visitor
Copyright © GuangDong ICP No. 10089450, Newell Shenzhen Electronic Technology Co., Ltd. All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility